We surrogate the wafers of several Russian wafer factories, meanwhile we also cooperate with some international and domestic IC design company to explode new product.

There are 4 inch, 5 inch, 6 inch wafers, the thickness is 280±20um、300±20um、350±20um、420±20um、460± 20um.

The material of backside metallization is Ti-Ni-Ag.

If you want to know more wafer information, please do not hesitate to contact our sales department located in Beijing head office. (Shenzhen branch office is not doing wafer sales.)